3d Ics Market Is Estimated To Witness High Growth Owing To Rising Demand For Portable Electronics11/30/2023 Market Overview:
3D ICs are being used by various industries for portable electronics such as smartphones, tablets, wearable devices, and others. 3D ICs enable packing a large number of transistors into a small form factor by stacking silicon wafers or dies and interconnecting them vertically. The key advantages of 3D ICs are reduced power consumption, high density and processing power, and miniaturization of electronic devices. Therefore, the growing demand for portable electronics is expected to drive the growth of the 3D ICs market over the forecast period. Market key trends: The growing demand for portable consumer electronics such as smartphones, gaming consoles, and wearable devices is fueling the 3D ICs market growth. According to the Consumer Technology Association (CTA), smartphone ownership in the US reached nearly 81% of the population in 2022 and tablet ownership reached 65% of the population. As processors and components in portable devices continue to shrink in size, 3D ICs help manufacturers pack more powerful processors and components into compact form factors. Furthermore, increasing R&D investments by manufacturers of 3D ICs to increase stacking densities and develop new through silicon via (TSV) technologies are expected to provide growth opportunities. For instance, XILINX Inc. has developed advanced 3D ICs with over 10,000 TSVs that enable stacking eight dies at a time. The development of such advanced 3D IC technologies is propelling the market growth. The global 3d Ics Market Demand is estimated to be valued at US$ 16937.26 Mn in 2023 and is expected to exhibit a CAGR of 22% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights. Porter’s Analysis Threat of new entrants: The high costs associated with R&D, production, and marketing of 3D ICs pose significant barriers for new entrants. Bargaining power of buyers: Buyers have moderate bargaining power given the significant technical expertise required in 3D IC design and fabrication. However, availability of substitutes provide buyers with alternatives. Bargaining power of suppliers: Leading foundries like TSMC possess strong bargaining power over chip designers and manufacturers due to their vast production capabilities and intellectual property. Threat of new substitutes: Continuous innovation in the semiconductor industry has increased the threat of new substitutes like 2.5D and System-in-Package technologies which offer cost and performance advantages over 3D ICs. Competitive rivalry: Intense competition exists among the top players to gain leading technology positions and market share. SWOT Analysis Strengths: 3D ICs enable higher transistor densities, bandwidth, and performance. They reduce chip footprint and production costs. Weaknesses: High manufacturing complexity and costs. Yield and reliability challenges during stacking of dies. Requirement of specialized equipment and expertise. Opportunities: Rising demand for advanced packaging in AI, IoT, and HPC applications. Growing adoption in mobile devices and servers. Threats: Slow customer adoption due to technology and cost limitations. Market entry of competing technologies. Macroeconomic uncertainties could impact industry investments. Key Takeaways The global 3D ICs market is expected to witness high growth, exhibiting CAGR of 22% over the forecast period, due to increasing demand for higher performance and power efficient semiconductors across industries. Asia Pacific dominates currently due to presence of leading foundries like TSMC and manufacturing hubs in China, South Korea and Taiwan. Regional analysis - North America and Europe are other major regions driven by continuous technology R&D activities. Asia Pacific is expected to continue dominating the market during the forecast period with China and South Korea emerging as high potential countries. Key players operating in the 3D ICs market are Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation. Leading players are focusing on new product developments to gain competitive advantages. Read More: https://www.dailyprbulletin.com/new-avenue-for-3d-ics-market-trend-and-share-analysis/
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